- 专利标题： Arrangement of a power semiconductor module and a cooler
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申请号： US17630080申请日： 2020-07-24
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公开(公告)号： US12068174B2公开(公告)日： 2024-08-20
- 发明人: Daniele Torresin , Fabian Mohn , Bruno Agostini , Thomas Gradinger , Juergen Schuderer
- 申请人： Hitachi Energy Ltd
- 申请人地址： CH Zurich
- 专利权人： Hitachi Energy Ltd
- 当前专利权人： Hitachi Energy Ltd
- 当前专利权人地址： CH Zurich
- 代理机构： Slater Matsil, LLP
- 优先权： EP 188381 2019.07.25
- 国际申请： PCT/EP2020/071001 2020.07.24
- 国际公布： WO2021/014002A 2021.01.28
- 进入国家日期： 2022-01-25
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L23/367 ; H01L23/473 ; H05K7/20
摘要：
In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.
公开/授权文献
- US20220254653A1 Arrangement of a Power Semiconductor Module and a Cooler 公开/授权日：2022-08-11
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