- 专利标题： Device packages with uniform components and methods of forming the same
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申请号： US17168251申请日： 2021-02-05
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公开(公告)号： US12074149B2公开(公告)日： 2024-08-27
- 发明人: Michael E. Watts , James Krehbiel , Mario Bokatius
- 申请人： MACOM Technology Solutions Holdings, Inc.
- 申请人地址： US MA Lowell
- 专利权人： MACOM Technology Solutions Holdings, Inc.
- 当前专利权人： MACOM Technology Solutions Holdings, Inc.
- 当前专利权人地址： US MA Lowell
- 代理机构： Myers Bigel, P.A.
- 主分类号： H01L25/16
- IPC分类号： H01L25/16 ; H01L23/00 ; H01L23/367 ; H01L23/66
摘要：
A semiconductor device package includes a first and a second input lead and a plurality of uniform transistor-based components, the plurality of uniform transistor-based components comprising a first subset of the uniform transistor-based components coupled to the first input lead and a second subset of the uniform transistor-based components coupled to the second input lead. The first subset and the second subset are arranged in an asymmetric configuration with respect to one another.
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