Invention Grant
- Patent Title: Substrate processing method, recording medium, and substrate processing apparatus
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Application No.: US17662867Application Date: 2022-05-11
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Publication No.: US12083553B2Publication Date: 2024-09-10
- Inventor: Yusuke Miyakubo
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP 21081106 2021.05.12
- Main IPC: B05D1/02
- IPC: B05D1/02 ; B05B12/02 ; B05D1/32

Abstract:
A substrate processing method includes performing a developing processing on a substrate. The developing processing includes supplying a developing liquid on a surface of the substrate to form a liquid film of the developing liquid on the surface of the substrate; maintaining the liquid film on the surface such that development progresses; and performing, during the maintaining of the liquid film, a first processing of supplying a gas to an inner region located inward of a peripheral region on the surface of the substrate and a second processing of supplying an adjusting liquid configured to suppress progress of the development on the peripheral region to adjust a degree of the development between the peripheral region and the inner region. The second processing is started after a start time of the first processing, and the second processing is ended after an end time of the first processing.
Public/Granted literature
- US20220371048A1 SUBSTRATE PROCESSING METHOD, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2022-11-24
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