- 专利标题: Electronic component and board having the same
-
申请号: US18196257申请日: 2023-05-11
-
公开(公告)号: US12087512B2公开(公告)日: 2024-09-10
- 发明人: Gyeong Ju Song , Beom Joon Cho , Seung Min Ahn
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR 20200140954 2020.10.28
- 主分类号: H01G4/30
- IPC分类号: H01G4/30 ; H01G2/06 ; H01G4/012 ; H01G4/12 ; H01G4/232
摘要:
There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
公开/授权文献
- US20230282422A1 ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 公开/授权日:2023-09-07
信息查询