Invention Grant
- Patent Title: Low-dispersion component in an electronic chip
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Application No.: US17566437Application Date: 2021-12-30
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Publication No.: US12087683B2Publication Date: 2024-09-10
- Inventor: François Tailliet , Guilhem Bouton
- Applicant: STMICROELECTRONICS (ROUSSET) SAS
- Applicant Address: FR Rousset
- Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee: STMICROELECTRONICS (ROUSSET) SAS
- Current Assignee Address: FR Rousset
- Agency: Seed IP Law Group LLP
- Priority: FR 56020 2016.06.28
- The original application number of the division: US16033109 2018.07.11
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/66 ; H01L21/768 ; H01L23/522 ; H01L23/528 ; H01L27/02 ; H01L49/02
Abstract:
A method of manufacturing electronic chips containing low-dispersion components, including the steps of: mapping the average dispersion of said components according to their position in test semiconductor wafers; associating, with each component of each chip, auxiliary correction elements; activating by masking the connection of the correction elements to each component according to the initial mapping.
Public/Granted literature
- US20220122910A1 LOW-DISPERSION COMPONENT IN AN ELECTRONIC CHIP Public/Granted day:2022-04-21
Information query
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