- 专利标题: Stacked power supply topologies and inductor devices
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申请号: US18206802申请日: 2023-06-07
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公开(公告)号: US12088205B2公开(公告)日: 2024-09-10
- 发明人: Kennith K. Leong , Matthias J. Kasper , Luca Peluso , Gerald Deboy
- 申请人: Infineon Technologies Austria AG
- 申请人地址: AT Villach
- 专利权人: Infineon Technologies Austria AG
- 当前专利权人: Infineon Technologies Austria AG
- 当前专利权人地址: AT Villach
- 代理机构: Armis IP Law, LLC
- 主分类号: H05K3/32
- IPC分类号: H05K3/32 ; H01F27/24 ; H01F27/28 ; H01F41/02 ; H01F41/04 ; H02M3/158 ; H02M3/335 ; H02M7/00 ; H05K1/18 ; H02M3/00
摘要:
According to one configuration, an inductor device comprises: core material and one or more electrically conductive paths. The core material is magnetically permeable and surrounds (envelops) the one or more electrically conductive paths. Each of the electrically conductive paths extends through the core material of the inductor device from a first end of the inductor device to a second end of the inductor device. The magnetically permeable core material is operative to confine (guide, carry, convey, localize, etc.) respective magnetic flux generated from current flowing through a respective electrically conductive path. The core material stores the magnetic flux energy (i.e., first magnetic flux) generated from the current flowing through the first electrically conductive path. One configuration herein includes a power converter assembly comprising a stack of components including the inductor device as previously described as well as a first power interface, a second power interface, and one or more switches.
公开/授权文献
- US20230318459A1 STACKED POWER SUPPLY TOPOLOGIES AND INDUCTOR DEVICES 公开/授权日:2023-10-05
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