Invention Grant
- Patent Title: Thermally compensated circuits
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Application No.: US17986606Application Date: 2022-11-14
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Publication No.: US12088250B2Publication Date: 2024-09-10
- Inventor: Hsien-Hung Wu
- Applicant: MACRONIX INTERNATIONAL CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee: MACRONIX INTERNATIONAL CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes Beffel & Wolfeld LLP
- Agent Andrew L. Dunlap
- Main IPC: H03B5/04
- IPC: H03B5/04 ; H03B5/24

Abstract:
A thermally compensated circuit includes a first adjustable circuit, like an adjustable current source, to produce a first adjustable signal, such a reference current. The circuit includes a second adjustable circuit to produce a second adjustable signal, such as a reference voltage. Circuitry responsive to the first and second adjustable signals produces an output, such as a clock signal. A tunable circuit in the first adjustable circuit and a tunable first element of the second adjustable circuit set an operating characteristic, such as a clock period, of the output to a target level at a first temperature. A tunable second element of the second adjustable circuit sets the operating characteristic of the output signal at the target level at a second temperature. Tuning of the second tunable element at the second temperature does not substantially change the operating characteristic of the output signal at the first temperature.
Public/Granted literature
- US20240162858A1 THERMALLY COMPENSATED CIRCUITS Public/Granted day:2024-05-16
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