Provided are a composition for forming an underlayer film for imprinting, including a curable component, and a particulate metal which has a particle diameter of 10 nm or larger, as measured by a single particle ICP-MASS method, and contains at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 50 ppt by mass to 10 ppb by mass with respect to the composition; a method for producing a composition for forming an underlayer film for imprinting; a pattern producing method; a method for manufacturing a semiconductor element; a cured product; and a kit.