Abstract:
There are provided a composition for forming an adhesive film for imprinting having excellent adhesiveness and wettability, an adhesive film, a laminate, a method for producing a cured product pattern, and a method for manufacturing a circuit substrate. A composition for forming an adhesive film for imprinting contains a resin having a polymerizable group; and a solvent, in which the resin has at least one kind of a repeating unit derived from a polymerizable compound having a C log P value less than or equal to 0, and solubility of the resin in water at 25° C. is greater than or equal to 1 mass %, provided that the C log P value is a coefficient showing affinity of an organic compound with respect to water and 1-octanol.
Abstract:
Provided are: a composition for forming an underlayer film for imprinting, which contains a high-molecular-weight compound having a polymerizable group, a chelating agent, and a solvent, and a method for producing the same; a kit including the composition for forming an underlayer film; a pattern producing method using the composition for forming an underlayer film; and a method for manufacturing a semiconductor element, which includes the pattern producing method as a step.
Abstract:
The curable composition for imprinting includes: a compound represented by the following Formula (1); a radically polymerizable compound other than the compound represented by Formula (1); and a photoradical polymerization initiator, in Formula (1), R1 and R2 each independently represent a hydrogen atom or an organic group having 1 to 8 carbon atoms and may be bonded to each other to form a ring, R3 represents a monovalent organic group, and R4 and R5 each independently represent a hydrogen atom or a monovalent organic group.
Abstract:
The present invention provides a discharge method which makes it possible to appropriately perform discharge even when a head for discharging microdroplets having a size of equal to or less than 6 pL that is necessary for controlling a residual film (forming a thin film and achieving uniformity) is used, and makes it possible to obtain an excellent pattern having excellent release properties. The discharge method is an inkjet discharge method including discharging a photocurable composition in the form of liquid droplets having a size of equal to or less than 6 pL, in which the composition satisfies the following (a) to (c), (a) containing a fluorine-containing material in a proportion of equal to or less than 4% by mass of the composition; (b) having a surface tension of 25 mN/m to 35 mN/m; and (c) containing a solvent having a boiling point of equal to or less than 200° C. in an amount of 5% by mass of the composition.
Abstract:
Provided is a kit including a curable composition for imprinting, and a composition for forming an underlayer film for imprinting, in which the composition for forming an underlayer film for imprinting contains a polymer having a polymerizable functional group, and a compound in which the lower one of a boiling point and a thermal decomposition temperature is 480° C. or higher and ΔHSP, which is a Hansen solubility parameter distance from a component with the highest content contained in the curable composition for imprinting, is 2.5 or less. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting, a pattern forming method, and a method for manufacturing a semiconductor device, which are related to the kit.
Abstract:
Provided are a curable composition for imprinting and a cured product, a pattern forming method, and a lithography method in which the curable composition for imprinting is used, the curable composition having excellent resolution ability, filling properties into a mold, and releasability from a mold in a case where a fine pattern having a size of 20 nm or less is prepared. The curable composition for imprinting includes: a monofunctional polymerizable compound; a bifunctional polymerizable compound; and a photopolymerization initiator, in which a content of the monofunctional polymerizable compound is 5 to 30 mass % with respect to a content of all the polymerizable compounds, a content of the bifunctional polymerizable compound is 70 mass % or higher with respect to a content of all the polymerizable compounds, at least one bifunctional polymerizable compound is a bifunctional polymerizable compound in which the number of atoms linking two polymerizable groups to each other is 2 or less, and a content of a bifunctional polymerizable compound that does not include an alicyclic structure and an aromatic ring structure and in which the number of atoms linking two polymerizable groups to each other is 3 or more is 30 mass % or lower with respect to the content of all the polymerizable compounds.
Abstract:
Provided are a resin composition for underlayer film formation with which a variation hardly occurs in the line width distribution after processing due to a small thickness of a residual film after mold pressing, a layered product, a method for forming a pattern, an imprint forming kit, and a process for producing a device.A resin composition for underlayer film formation includes a resin having a group represented by General Formula (A) and at least one group selected from a group represented by General Formula (B), an oxiranyl group and an oxetanyl group, a nonionic surfactant and a solvent. Ra1 represents a hydrogen atom or a methyl group, Rb1 and Rb2 each independently represent a group selected from an unsubstituted linear or branched alkyl group having 1 to 20 carbon atoms and an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, Rb3 represents a group selected from an unsubstituted linear or branched alkyl group having 2 to 20 carbon atoms and an unsubstituted cycloalkyl group having 3 to 20 carbon atoms, and Rb2 and Rb3 may be bonded to each other to form a ring.
Abstract:
Provided are a curable composition having excellent releasability and ink jet discharge accuracy, a pattern forming method, a pattern, and a method for manufacturing a device.The curable composition includes a polymerizable compound and a photopolymerization initiator, in which neopentyl glycol diacrylate accounts for 10% by mass or more of the polymerizable compound, and the total content of a compound represented by the following Formula (I) and a compound represented by the following Formula (II) is 5% by mass or less with respect to the content of neopentyl glycol diacrylate.
Abstract:
Provided are a composition for forming an underlayer film for imprinting, including a curable component, and a particulate metal which has a particle diameter of 10 nm or larger, as measured by a single particle ICP-MASS method, and contains at least one kind of iron, copper, titanium, or lead, in which a content of the particulate metal is 50 ppt by mass to 10 ppb by mass with respect to the composition; a method for producing a composition for forming an underlayer film for imprinting; a pattern producing method; a method for manufacturing a semiconductor element; a cured product; and a kit.
Abstract:
Provided is a kit including a curable composition for imprinting which contains a polymerizable compound having an aromatic ring and a composition for forming an underlayer film for imprinting which contains a polymer and a solvent, in which the polymer contains at least one kind of specific constitutional unit and has a polymerizable group, a film formed of the composition for forming an underlayer film for imprinting is a solid film at 23° C., and a portion that has a continuous partial structure containing an aromatic ring which is included in the polymerizable compound and accounts for 60% by mass or more of the polymerizable compound is common to a continuous partial structure containing an aromatic ring which is included in a substituent R in a side chain in the polymer. Furthermore, the present invention relates to a composition for forming an underlayer film for imprinting which is used in combination with a curable composition for imprinting; a laminate; a method for producing a laminate; a method for producing a cured product pattern; and a method for manufacturing a circuit board.