Invention Grant
- Patent Title: Photonics chips with reticle stitching by side-by-side tapered sections
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Application No.: US17835513Application Date: 2022-06-08
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Publication No.: US12092868B2Publication Date: 2024-09-17
- Inventor: Yusheng Bian
- Applicant: GlobalFoundries U.S. Inc.
- Applicant Address: US NY Malta
- Assignee: GlobalFoundries U.S. Inc.
- Current Assignee: GlobalFoundries U.S. Inc.
- Current Assignee Address: US NY Malta
- Agency: Thompson Hine LLP
- Agent Anthony Canale
- Main IPC: G02B6/12
- IPC: G02B6/12 ; G02B6/122 ; G02B6/13

Abstract:
Structures including a waveguide core and methods of fabricating a structure including a waveguide core. The structure comprises a photonics chip including a first chip region, a first waveguide core in the first chip region, a second chip region, and a second waveguide core in the second chip region. The first chip region adjoins the second chip region along a boundary, the first waveguide core includes a first tapered section and the second waveguide core includes a second tapered section adjacent to the first tapered section. The first tapered section has a first longitudinal axis aligned substantially parallel to the boundary, and the second tapered section has a second longitudinal axis aligned substantially parallel to the boundary.
Public/Granted literature
- US20230400633A1 PHOTONICS CHIPS WITH RETICLE STITCHING BY SIDE-BY-SIDE TAPERED SECTIONS Public/Granted day:2023-12-14
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