Invention Grant
- Patent Title: Methods for low resistivity and stress tungsten gap fill
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Application No.: US17857341Application Date: 2022-07-05
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Publication No.: US12094773B2Publication Date: 2024-09-17
- Inventor: Xi Cen , Kai Wu , Min Heon , Wei Min Chan , Tom Ho Wing Yu , Peiqi Wang , Ju Ik Kang , Feihu Wang , Nobuyuki Sasaki , Chunming Zhou
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: MOSER TABOA
- The original application number of the division: US17082602 2020.10.28
- Main IPC: H01L21/768
- IPC: H01L21/768 ; C23C16/04 ; H01L21/02

Abstract:
Method for forming tungsten gap fill on a structure, including high aspect ratio structures includes depositing a tungsten liner in the structure using a physical vapor deposition (PVD) process with high ionization and an ambient gas of argon or krypton. The PVD process is performed at a temperature of approximately 20 degrees Celsius to approximately 300 degrees Celsius. The method further includes treating the structure with a nitridation process and depositing bulk fill tungsten into the structure using a chemical vapor deposition (CVD) process to form a seam suppressed boron free tungsten fill. The CVD process is performed at a temperature of approximately 300 degrees Celsius to approximately 500 degrees Celsius and at a pressure of approximately 5 Torr to approximately 300 Torr.
Public/Granted literature
- US20220336274A1 METHODS FOR LOW RESISTIVITY AND STRESS TUNGSTEN GAP FILL Public/Granted day:2022-10-20
Information query
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