Invention Grant
- Patent Title: Analog sense points for measuring circuit die
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Application No.: US17561396Application Date: 2021-12-23
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Publication No.: US12094789B2Publication Date: 2024-09-17
- Inventor: Christopher F. Kinney
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L21/52
- IPC: H01L21/52 ; H01L21/66 ; H01L23/00 ; H01L23/31
Abstract:
Various embodiments described herein provide analog sense points for circuit die, which can form part of an integrated circuit (IC) package and can facilitate measurement of at least a portion of the circuit die using a Kelvin method of measurement.
Public/Granted literature
- US20230207401A1 ANALOG SENSE POINTS FOR MEASURING CIRCUIT DIE Public/Granted day:2023-06-29
Information query
IPC分类:
