公开(公告)号：US12094789B2

公开(公告)日：2024-09-17

申请号：US17561396

申请日：2021-12-23

Applicant: Micron Technology, Inc.

Inventor： Christopher F. Kinney

IPC: H01L21/52 ,  H01L21/66 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L22/32 ,  H01L21/52 ,  H01L23/3157 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16227

Abstract: Various embodiments described herein provide analog sense points for circuit die, which can form part of an integrated circuit (IC) package and can facilitate measurement of at least a portion of the circuit die using a Kelvin method of measurement.

公开(公告)号：US20250125266A1

公开(公告)日：2025-04-17

申请号：US18990461

申请日：2024-12-20

Applicant: Micron Technology, Inc.

Inventor： Christopher F. Kinney

IPC: H01L23/528 ,  G11C5/06 ,  H01L23/522

Abstract: Aspects of the present disclosure are directed to systems and methods to reduce inductance on an integrated circuit package of a memory sub-system. A memory sub-system is also hereinafter referred to as a “memory device.” An example of a memory sub-system is a storage system, such as a SSD, and can be embodied as an integrated circuit package, including but not limited to a pin grid array (PGA), and ball grid array (BGA).

公开(公告)号：US20230207401A1

公开(公告)日：2023-06-29

申请号：US17561396

申请日：2021-12-23

Applicant: Micron Technology, Inc.

Inventor： Christopher F. Kinney

IPC: H01L21/66 ,  H01L23/31 ,  H01L23/00 ,  H01L21/52

CPC classification number: H01L22/32 ,  H01L23/3157 ,  H01L24/16 ,  H01L21/52 ,  H01L24/81 ,  H01L2224/16227

Abstract: Various embodiments described herein provide analog sense points for circuit die, which can form part of an integrated circuit (IC) package and can facilitate measurement of at least a portion of the circuit die using a Kelvin method of measurement.