Invention Grant
- Patent Title: Source/drain isolation structures for leakage prevention
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Application No.: US17815999Application Date: 2022-07-29
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Publication No.: US12094927B2Publication Date: 2024-09-17
- Inventor: Yen-Yu Chen , Chung-Liang Cheng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- The original application number of the division: US16877800 2020.05.19
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/8234 ; H01L29/417 ; H01L29/66 ; H01L29/78

Abstract:
The present disclosure is directed to gate-all-around (GAA) transistor structures with a low level of leakage current and low power consumption. For example, the GAA transistor includes a semiconductor layer with a first source/drain (S/D) epitaxial structure and a second S/D epitaxial structure disposed thereon, where the first and second S/D epitaxial structures are spaced apart by semiconductor nano-sheet layers. The semiconductor structure further includes isolation structures interposed between the semiconductor layer and each of the first and second S/D epitaxial structures. The GAA transistor further includes a gate stack surrounding the semiconductor nano-sheet layers.
Public/Granted literature
- US20220367621A1 Source/Drain Isolation Structures For Leakage Prevention Public/Granted day:2022-11-17
Information query
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