- 专利标题: Ion conductive layer and methods of forming
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申请号: US17239307申请日: 2021-04-23
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公开(公告)号: US12095089B2公开(公告)日: 2024-09-17
- 发明人: Yuto Takagi , Chuanping Li , Ruofan Wang , Michael McGahan , Vladimir Ouspenski , Jeremy Flamanc
- 申请人: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
- 申请人地址: US MA Worcester
- 专利权人: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
- 当前专利权人: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
- 当前专利权人地址: US MA Worcester
- 代理机构: Abel Schillinger, LLP
- 代理商 Adrian Lawrence
- 主分类号: H01M4/60
- IPC分类号: H01M4/60 ; H01M4/36 ; H01M4/38 ; H01M10/052 ; H01M10/0525 ; H01M10/0562 ; H01M4/02
摘要:
A solid ion conductive layer can include a foamed matrix and an electrolyte material including a hygroscopic material. In an embodiment, the electrolyte material can include a halide-based material, a sulfide-based material, or any combination thereof. In another embodiment, the solid ion conductive layer can include total porosity of at least 30 vol % for a total volume of the solid ion conductive layer.
公开/授权文献
- US20210336265A1 ION CONDUCTIVE LAYER AND METHODS OF FORMING 公开/授权日:2021-10-28
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