发明授权
- 专利标题: Wiring component
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申请号: US17595399申请日: 2020-05-14
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公开(公告)号: US12095110B2公开(公告)日: 2024-09-17
- 发明人: Hiroya Yokoyama , Minoru Sakata
- 申请人: ASAHI KASEI KABUSHIKI KAISHA
- 申请人地址: JP Tokyo
- 专利权人: ASAHI KASEI KABUSHIKI KAISHA
- 当前专利权人: ASAHI KASEI KABUSHIKI KAISHA
- 当前专利权人地址: JP Tokyo
- 代理机构: KENJA IP LAW PC
- 优先权: JP 19093920 2019.05.17
- 国际申请: PCT/JP2020/019240 2020.05.14
- 国际公布: WO2020/235437A 2020.11.26
- 进入国家日期: 2021-11-16
- 主分类号: H01M50/298
- IPC分类号: H01M50/298 ; C08L71/12 ; H01M50/50 ; H01M50/588 ; H01M50/591
摘要:
Provided is a wiring component having a covering material which is made to be resistant to damages or displacements even when a large amount of electricity is conducted. A wiring component of the present disclosure is a wiring component including an electrically conductive member having an extension length of 450 mm or more, and a covering member covering the electrically conductive member, wherein the covering member contains a polyphenylene ether resin composition, and has a secondary shrinkage A (%) in an extension length direction of the covering member after being subjected to thermal aging at 130° C. for 24 hours satisfying: A
公开/授权文献
- US20220216563A1 WIRING COMPONENT 公开/授权日:2022-07-07
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