Invention Grant
- Patent Title: Through-substrate laser patterning and isolating of thin conductive films
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Application No.: US16961800Application Date: 2019-01-16
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Publication No.: US12098093B2Publication Date: 2024-09-24
- Inventor: James Gregory Couillard , Ming-Huang Huang , Xinghua Li
- Applicant: CORNING INCORPORATED , VIEW, INC.
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED,VIEW, INC.
- Current Assignee: CORNING INCORPORATED,VIEW, INC.
- Current Assignee Address: US NY Corning; US CA Milpitas
- Agent Daniel J. Greenhalgh
- International Application: PCT/US2019/013732 2019.01.16
- International Announcement: WO2019/143646A 2019.07.25
- Date entered country: 2020-07-13
- Main IPC: B32B43/00
- IPC: B32B43/00 ; C03C17/34 ; E06B9/24 ; G02F1/155

Abstract:
Embodiments of a composite structure are provided, the composite structure including: a substrate layer, a conductive layer and an overlayer. The conductive layer is disposed between the overlayer and the substrate layer. The substrate layer may comprise a material that is optically transparent over at least a part of the electromagnetic spectrum from 180 nm to 20 μm. The conductive layer includes a thickness of 10 nm or greater, a resistivity of 10 Ω-cm or less, and is an optically translucent or opaque over at least a part of the electromagnetic spectrum from 180 nm to 20 μm.
Public/Granted literature
- US20210070653A1 THROUGH-SUBSTRATE LASER PATTERNING AND ISOLATING OF THIN CONDUCTIVE FILMS Public/Granted day:2021-03-11
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