- 专利标题: Wafer transfer device and wafer transfer method
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申请号: US17636208申请日: 2021-09-24
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公开(公告)号: US12100606B2公开(公告)日: 2024-09-24
- 发明人: Tianyao Wu , Hao Wang , Xinglong Chen , Tao Miao
- 申请人: SHENYANG KINGSEMI Co., Ltd.
- 申请人地址: CN Shenyang
- 专利权人: SHENYANG KINGSEMI Co., Ltd.
- 当前专利权人: SHENYANG KINGSEMI Co., Ltd.
- 当前专利权人地址: CN Shenyang
- 代理机构: Ziegler IP Law Group LLC.
- 优先权: CN 2110997889.5 2021.08.27
- 国际申请: PCT/CN2021/120095 2021.09.24
- 国际公布: WO2023/024207A 2023.03.02
- 进入国家日期: 2022-02-17
- 主分类号: H01L21/677
- IPC分类号: H01L21/677 ; H01L21/683 ; H01L21/687
摘要:
The wafer transfer device includes a first supporting mechanism, a second supporting mechanism, a first picking-conveying mechanism and a second picking-conveying mechanism, wherein the first picking-conveying mechanism and the second picking-conveying mechanism include tail end execution parts facing opposite directions. The wafer transfer device further includes a rotating mechanism and a rotating driving part, wherein the first supporting mechanism and the second supporting mechanism are fixedly arranged at the rotating mechanism, and the rotating driving part drives the rotating mechanism to rotate and then drives the first supporting mechanism and the second supporting mechanism to rotate synchronously. The wafer transfer device can extend the picking and conveying range of a wafer, thus facilitating the improvement of the productivity.
公开/授权文献
- US20230343623A1 WAFER TRANSFER DEVICE AND WAFER TRANSFER METHOD 公开/授权日:2023-10-26
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