公开(公告)号：US12100606B2

公开(公告)日：2024-09-24

申请号：US17636208

申请日：2021-09-24

申请人： SHENYANG KINGSEMI Co., Ltd.

发明人： Tianyao Wu ,  Hao Wang ,  Xinglong Chen ,  Tao Miao

IPC分类号： H01L21/677 ,  H01L21/683 ,  H01L21/687

CPC分类号： H01L21/67706 ,  H01L21/67712 ,  H01L21/6838 ,  H01L21/68707

摘要： The wafer transfer device includes a first supporting mechanism, a second supporting mechanism, a first picking-conveying mechanism and a second picking-conveying mechanism, wherein the first picking-conveying mechanism and the second picking-conveying mechanism include tail end execution parts facing opposite directions. The wafer transfer device further includes a rotating mechanism and a rotating driving part, wherein the first supporting mechanism and the second supporting mechanism are fixedly arranged at the rotating mechanism, and the rotating driving part drives the rotating mechanism to rotate and then drives the first supporting mechanism and the second supporting mechanism to rotate synchronously. The wafer transfer device can extend the picking and conveying range of a wafer, thus facilitating the improvement of the productivity.