Invention Grant
- Patent Title: Antistatic resin composition comprising thermoplastic resin and conductive filler
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Application No.: US17761355Application Date: 2021-10-22
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Publication No.: US12104053B2Publication Date: 2024-10-01
- Inventor: Gwan Yeong Kim , Kyu Hyun Kang , Hye Won Jang
- Applicant: DAEJIN ADVANCED MATERIALS INC.
- Applicant Address: KR Gyeonggi-do
- Assignee: DAEJIN ADVANCED MATERIALS INC.
- Current Assignee: DAEJIN ADVANCED MATERIALS INC.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20210091602 2021.07.13
- International Application: PCT/KR2021/014949 2021.10.22
- International Announcement: WO2023/286923A 2023.01.19
- Date entered country: 2022-03-17
- Main IPC: C08L55/02
- IPC: C08L55/02 ; C08K13/06 ; C08K3/04 ; C08K7/06 ; C08K9/08

Abstract:
Provided is an antistatic resin composition, which includes: a thermoplastic resin including a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer and thermoplastic polyurethane (TPU); and a conductive filler including carbon nanotubes. A molded article manufactured using the composition of the present invention has the advantage of improved tensile strength, impact resistance, and surface resistance.
Public/Granted literature
- US20240043680A1 ANTISTATIC RESIN COMPOSITION COMPRISING THERMOPLASTIC RESIN AND CONDUCTIVE FILLER Public/Granted day:2024-02-08
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