An array substrate has a display area and a bezel area located on at least one side of the display area. The bezel area includes a bonding region. The array substrate includes a substrate, a plurality of signal lines, a plurality of conductive bumps, and an insulating layer. The signal lines are disposed on the substrate. The conductive blocks are disposed on a portion of the substrate located in the bonding region, and a conductive bump is connected to at least one signal line. The insulating layer covers the plurality of signal lines and is located between every two adjacent conductive bumps. The conductive bump includes a conductive metal layer. A distance from a surface of the conductive metal layer away from the substrate to the substrate is less than or equal to a distance from a surface of the insulating layer away from the substrate to the substrate.