发明授权
- 专利标题: Method and device for testing array substrate, and computer readable storage medium
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申请号: US17033790申请日: 2020-09-27
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公开(公告)号: US12107020B2公开(公告)日: 2024-10-01
- 发明人: Peixin Lin
- 申请人: HKC CORPORATION LIMITED
- 申请人地址: CN Shenzhen
- 专利权人: HKC CORPORATION LIMITED
- 当前专利权人: HKC CORPORATION LIMITED
- 当前专利权人地址: CN Shenzhen
- 代理机构: Westbridge IP LLC
- 优先权: CN 1811483443.5 2018.12.05
- 主分类号: G01R31/52
- IPC分类号: G01R31/52 ; G01R31/26 ; G02F1/1362 ; H01L21/66 ; H01L27/12 ; G02F1/1333
摘要:
Disclosed is a method for testing an array substrate, including: sequentially applying a curing drive signal to curing pad circuits according to an arrangement order of the curing pad circuits in a testing circuit board, the curing pad circuit is connected with at least two array substrates; and performing an array test on the array substrates in the curing pad circuit by the curing drive signal. The present application also discloses a device for testing an array substrate, and a computer readable storage medium.
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