- Patent Title: Microelectronic support for millimeter-wave communication including a transmission line trace and via pad spaced apart from a respective anti-trace and anti-pad
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Application No.: US16911934Application Date: 2020-06-25
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Publication No.: US12107314B2Publication Date: 2024-10-01
- Inventor: Neelam Prabhu Gaunkar , Georgios Dogiamis , Telesphor Kamgaing , Henning Braunisch , Diego Correas-Serrano
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Intel Corporation
- Main IPC: H01P5/02
- IPC: H01P5/02 ; H01P1/04 ; H01P1/20 ; H01P3/00 ; H01P3/16 ; H01Q5/328 ; H01Q13/26
Abstract:
Disclosed herein are components for millimeter-wave communication, as well as related methods and systems.
Public/Granted literature
- US20210408655A1 COMPONENTS FOR MILLIMETER-WAVE COMMUNICATION Public/Granted day:2021-12-30
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