Invention Grant
- Patent Title: Complementary die-to-die interface
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Application No.: US17194003Application Date: 2021-03-05
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Publication No.: US12112113B2Publication Date: 2024-10-08
- Inventor: Sergio Kolor , Dany Davidov , Nir Leshem , Mark Pilip , Lior Zimet
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kowert, Hood, Munyon, Rankin & Goetzel, P.C.
- Agent Scott W. Pape; Dean M. Munyon
- Main IPC: G06F30/392
- IPC: G06F30/392 ; G06F13/40 ; G06F115/02

Abstract:
A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance.
Public/Granted literature
- US20220284163A1 Complementary Die-to-Die Interface Public/Granted day:2022-09-08
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