公开(公告)号：US11934313B2

公开(公告)日：2024-03-19

申请号：US17821296

申请日：2022-08-22

Applicant: Apple Inc.

Inventor： Per H. Hammarlund ,  Lior Zimet ,  James Vash ,  Gaurav Garg ,  Sergio Kolor ,  Harshavardhan Kaushikkar ,  Ramesh B. Gunna ,  Steven R. Hutsell

IPC: G06F12/0815 ,  G06F12/0811 ,  G06F12/0831 ,  G06F12/109 ,  G06F12/128 ,  G06F13/16 ,  G06F13/28 ,  G06F13/40 ,  G06F15/173 ,  G06F15/78

CPC classification number: G06F12/0831 ,  G06F12/0811 ,  G06F12/0815 ,  G06F12/109 ,  G06F12/128 ,  G06F13/161 ,  G06F13/1668 ,  G06F13/28 ,  G06F13/4068 ,  G06F15/17368 ,  G06F15/7807 ,  G06F2212/305 ,  G06F2212/657

Abstract: A system including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture.

公开(公告)号：US20220365900A1

公开(公告)日：2022-11-17

申请号：US17320082

申请日：2021-05-13

Applicant: Apple Inc.

Inventor： Sergio Kolor ,  Oren Bar ,  Ilya Granovsky

IPC: G06F15/17 ,  G06F15/78 ,  G06F13/40 ,  G06F9/445 ,  G06F9/4401 ,  G06F9/54

Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a memory controller circuit and a plurality of networks formed from a plurality of individual network component circuits. The memory controller includes a PIO message control circuit that is configured to receive PIO messages addressed to individual network component circuits and determine whether to send the PIO messages to the individual network component circuits based on determine whether previous PIO messages are pending for the individual network component circuits. The PIO message control circuit is configured to delay a first PIO message at the PIO message control circuit in response to determining that previous PIO message is pending for the addressee of the first PIO message.

公开(公告)号：US20220334997A1

公开(公告)日：2022-10-20

申请号：US17337805

申请日：2021-06-03

Applicant: Apple Inc.

Inventor： Sergio Kolor ,  Sergio V. Tota ,  Tzach Zemer ,  Sagi Lahav ,  Jonathan M. Redshaw ,  Per H. Hammarlund ,  Eran Tamari ,  James Vash ,  Gaurav Garg

IPC: G06F13/40 ,  G06F15/173

Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network.

公开(公告)号：US12047302B2

公开(公告)日：2024-07-23

申请号：US18326246

申请日：2023-05-31

Applicant: Apple Inc.

Inventor： Dany Davidov ,  Nir Leshem ,  Mark Pilip ,  Sergio Kolor

IPC: H04L47/35 ,  H04L47/32 ,  H04L69/22

CPC classification number: H04L47/35 ,  H04L47/32 ,  H04L69/22

Abstract: An apparatus includes an interface circuit and an encoder circuit. The interface circuit is configured to send a data packet via a plurality of segments, and to send an idle value via the plurality of segments when no data packet is available. The idle value is configured to cause a segment in a receiving apparatus to idle. The encoder circuit is configured to receive a particular data packet, and, if a portion of the particular data packet has a same value as the idle value for a subset of the plurality of segments, to replace at least a portion of the data packet with a mask value to generate a modified data packet. The mask value indicates how to recreate the particular data packet. The encoder circuit is further configured to send the modified data packet to the receiving apparatus via the plurality of segments of the interface circuit.

公开(公告)号：US12007895B2

公开(公告)日：2024-06-11

申请号：US17821305

申请日：2022-08-22

Applicant: Apple Inc.

Inventor： Per H. Hammarlund ,  Eran Tamari ,  Lior Zimet ,  Sergio Kolor ,  Sergio V. Tota ,  Sagi Lahav ,  James Vash ,  Gaurav Garg ,  Jonathan M. Redshaw ,  Steven R. Hutsell ,  Harshavardhan Kaushikkar ,  Shawn M. Fukami

IPC: G06F12/08 ,  G06F12/0811 ,  G06F12/0815 ,  G06F12/0831 ,  G06F12/109 ,  G06F12/128 ,  G06F13/16 ,  G06F13/28 ,  G06F13/40 ,  G06F15/173 ,  G06F15/78

CPC classification number: G06F12/0831 ,  G06F12/0811 ,  G06F12/0815 ,  G06F12/109 ,  G06F12/128 ,  G06F13/161 ,  G06F13/1668 ,  G06F13/28 ,  G06F13/4068 ,  G06F15/17368 ,  G06F15/7807 ,  G06F2212/305 ,  G06F2212/657

Abstract: A system including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture.

公开(公告)号：US20230058989A1

公开(公告)日：2023-02-23

申请号：US17821312

申请日：2022-08-22

Applicant: Apple Inc.

Inventor： Per H. Hammarlund ,  Lior Zimet ,  Sergio Kolor ,  Sagi Lahav ,  James Vash ,  Gaurav Garg ,  Tal Kuzi ,  Jeffry E. Gonion ,  Charles E. Tucker ,  Lital Levy-Rubin ,  Dany Davidov ,  Steven Fishwick ,  Nir Leshem ,  Mark Pilip ,  Gerard R. Williams, III ,  Harshavardhan Kaushikkar ,  Srinivasan Rangan Sridharan

IPC: G06F12/0831 ,  G06F12/0811 ,  G06F12/128

Abstract: An integrated circuit (IC) including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture. For example, the IC may include an interconnect fabric configured to provide communication between the one or more memory controller circuits and the processor cores, graphics processing units, and peripheral devices; and an off-chip interconnect coupled to the interconnect fabric and configured to couple the interconnect fabric to a corresponding interconnect fabric on another instance of the integrated circuit, wherein the interconnect fabric and the off-chip interconnect provide an interface that transparently connects the one or more memory controller circuits, the processor cores, graphics processing units, and peripheral devices in either a single instance of the integrated circuit or two or more instances of the integrated circuit.

公开(公告)号：US20220284163A1

公开(公告)日：2022-09-08

申请号：US17194003

申请日：2021-03-05

Applicant: Apple Inc.

Inventor： Sergio Kolor ,  Dany Davidov ,  Nir Leshem ,  Mark Pilip

IPC: G06F30/392

Abstract: A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance.

公开(公告)号：US20240411695A1

公开(公告)日：2024-12-12

申请号：US18739055

申请日：2024-06-10

Applicant: Apple Inc.

Inventor： Per H. Hammarlund ,  Eran Tamari ,  Lior Zimet ,  Sergio Kolor ,  Sergio Tota ,  Sagi Lahav ,  James Vash ,  Gaurav Garg ,  Jonathan M. Redshaw ,  Steven R. Hutsell ,  Harshavardhan Kaushikkar ,  Shawn M. Fukami

IPC: G06F12/0831 ,  G06F12/0811 ,  G06F12/0815 ,  G06F12/109 ,  G06F12/128 ,  G06F13/16 ,  G06F13/28 ,  G06F13/40 ,  G06F15/173 ,  G06F15/78

Abstract: A system including a plurality of processor cores, a plurality of graphics processing units, a plurality of peripheral circuits, and a plurality of memory controllers is configured to support scaling of the system using a unified memory architecture.

公开(公告)号：US20240403532A1

公开(公告)日：2024-12-05

申请号：US18799297

申请日：2024-08-09

Applicant: Apple Inc.

Inventor： Sergio Kolor ,  Dany Davidov

IPC: G06F30/392 ,  G06F13/40 ,  G06F115/02

Abstract: A system includes a first instance and a second instance of an integrated circuit. The integrated circuits include respective external interfaces with a physical pin layout having transmit and receive pins for a particular bus located in complementary positions relative to an axis of symmetry. The external interfaces of the first and second instances of the integrated circuit are positioned such that the transmit and receive pins for the given I/O signal on the first instance are aligned, respectively, with the receive and transmit pins for the given I/O signal on the second instance.

公开(公告)号：US20230350828A1

公开(公告)日：2023-11-02

申请号：US18309192

申请日：2023-04-28

Applicant: Apple Inc.

Inventor： Sergio Kolor ,  Sergio V. Tota ,  Tzach Zemer ,  Sagi Lahav ,  Jonathan M. Redshaw ,  Per H. Hammarlund ,  Eran Tamari ,  James Vash ,  Gaurav Garg ,  Lior Zimet ,  Harshavardhan Kaushikkar ,  Steven Fishwick ,  Steven R. Hutsell ,  Shawn M. Fukami

IPC: G06F15/173 ,  G06F13/40

CPC classification number: G06F13/4027 ,  G06F13/4022 ,  G06F15/17375 ,  G06F15/17381

Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network.