- 专利标题: Arrangement apparatus and arrangement method
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申请号: US17599535申请日: 2020-08-20
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公开(公告)号: US12112962B2公开(公告)日: 2024-10-08
- 发明人: Kohei Seyama
- 申请人: SHINKAWA LTD.
- 申请人地址: JP Tokyo
- 专利权人: SHINKAWA LTD.
- 当前专利权人: SHINKAWA LTD.
- 当前专利权人地址: JP Tokyo
- 代理机构: JCIPRNET
- 国际申请: PCT/JP2020/031466 2020.08.20
- 国际公布: WO2022/038745A 2022.02.24
- 进入国家日期: 2021-09-28
- 主分类号: H01L21/67
- IPC分类号: H01L21/67 ; G03F7/00 ; H01L21/02 ; H01L21/60 ; H01L21/68
摘要:
An arrangement apparatus includes a stage, an arrangement part, and a control part. The stage supports a substrate. The arrangement part holds a die and arranges multiple dies on the substrate supported by the stage. The control part has a map data indicating arrangement positions of the dies and generated based on a positional relationship among patterns formed by an exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.
公开/授权文献
- US20220319885A1 ARRANGEMENT APPARATUS AND ARRANGEMENT METHOD 公开/授权日:2022-10-06
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