Invention Grant
- Patent Title: Semiconductor device including gate structure and separation structure
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Application No.: US18236823Application Date: 2023-08-22
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Publication No.: US12113112B2Publication Date: 2024-10-08
- Inventor: Yongho Jeon , Sekoo Kang , Keunhee Bai , Dongseok Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Muir Patent Law, PLLC
- Priority: KR 20190064022 2019.05.30
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/40

Abstract:
A semiconductor device includes first and second gate structures respectively on first and second active regions and an insulating layer between the first and second active regions and a separation structure between a first end portion of the first gate structure and a second end portion of the second gate structure and extending into the insulating layer. The separation structure includes a lower portion, an intermediate portion, and an upper portion, a maximum width of the intermediate portion in the first direction is greater than a maximum width of the lower portion in the first direction, and the maximum width of the intermediate portion is greater than a maximum width of the upper portion in the first direction.
Public/Granted literature
- US20230395674A1 SEMICONDUCTOR DEVICE INCLUDING GATE STRUCTURE AND SEPARATION STRUCTURE Public/Granted day:2023-12-07
Information query
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