An acoustic resonator is fabricated with multiple piezoelectric plate thicknesses on a single chip. After conductor patterns are formed on a piezoelectric plate, the plate is bonded to a sacrificial substrate, with the conductor patterns facing the sacrificial substrate. The piezoelectric plate is then thinned to a desired thickness for shunt resonators. A mask is applied to the surface of the plate and selected areas of the piezoelectric plate are further thinned to a desired thickness for series resonators to form a thinned piezoelectric plate. A substrate with swimming pool cavities is bonded to the thinned piezoelectric plate, and the sacrificial substrate is removed.