Invention Grant
- Patent Title: Semiconductor device and method of forming the same
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Application No.: US17558323Application Date: 2021-12-21
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Publication No.: US12114490B2Publication Date: 2024-10-08
- Inventor: Naoyoshi Kobayashi , Tsuyoshi Tomoyama
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: H10B12/00
- IPC: H10B12/00

Abstract:
An apparatus includes a substrate; a memory cell region provided over the substrate; a peripheral region provided over the substrate and adjacent to the memory cell region; and a plurality of word-lines extending in parallel across the memory cell region and the peripheral region; a first insulating film covering top surfaces of the plurality of word-lines in each of the memory cell region and the peripheral region and covering side surfaces of upper portions of the plurality of word-lines in the peripheral region without covering side surfaces of the upper portions of the plurality of word-lines in the memory cell region.
Public/Granted literature
- US20230200058A1 SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME Public/Granted day:2023-06-22
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