- 专利标题: High reliability, microchannel heat pipe array for improved efficiency, simplified charging/discharging and low-cost manufacture
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申请号: US17861830申请日: 2022-07-11
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公开(公告)号: US12117253B2公开(公告)日: 2024-10-15
- 发明人: Jesse W. Edwards , Abhishek Yadav , Simbarashe Nyika , Devon Newman
- 申请人: Phononic, Inc.
- 申请人地址: US NC Durham
- 专利权人: Phononic, Inc.
- 当前专利权人: Phononic, Inc.
- 当前专利权人地址: US NC Durham
- 代理机构: Withrow + Terranova, PLLC
- 主分类号: F28F9/16
- IPC分类号: F28F9/16 ; F28F9/02
摘要:
Systems and method for providing a micro-channel array are provided. In some embodiments, a micro-channel array includes a plurality of micro-channels having a first end and a second end; where at least one of the first end and the second end allows fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes external manifolding for fluid connectivity between the plurality of micro-channels. In some embodiments, the micro-channel array includes internal manifolding for fluid connectivity between the plurality of micro-channels. This may solve one of the largest causes of low yields and poor performance consistency in the production process while at the same time simplifying production and reducing production costs.
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