Invention Grant
- Patent Title: Touch sensing integrated circuit system, touch sensing system, and method for writing firmware
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Application No.: US18297313Application Date: 2023-04-07
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Publication No.: US12118364B2Publication Date: 2024-10-15
- Inventor: Gyu Chul Lee
- Applicant: SILICON WORKS CO., LTD.
- Applicant Address: KR Daejeon
- Assignee: SILICON WORKS CO., LTD.
- Current Assignee: SILICON WORKS CO., LTD.
- Current Assignee Address: KR Daejeon
- Agency: ROTHWELL, FIGG, ERNST & MANBECK, P.C.
- Priority: KR 20190167986 2019.12.16
- Main IPC: G06F9/44
- IPC: G06F9/44 ; G06F9/4401 ; G06F3/041
Abstract:
An embodiment is able to simplify the design and manufacturing process by unifying the step of writing boot loaders to the integrated circuits.
Public/Granted literature
- US20230251868A1 TOUCH SENSING INTEGRATED CIRCUIT SYSTEM, TOUCH SENSING SYSTEM, AND METHOD FOR WRITING FIRMWARE Public/Granted day:2023-08-10
Information query
