To obtain a chip package positioning structure capable of adjusting a tilt and a position of a chip package with respect to the circuit board and reducing mounting variations. The chip package positioning and fixing structure that positions and fixes, to a circuit board 4, a chip package 5 in which a flow rate detection element 53 is sealed with a resin so that a detection portion is at least exposed, in which the chip package includes a solder fixation portion 52 that fixes the chip package to the circuit board by soldering, and a positioning portion 514 that performs positioning to the circuit board, and the positioning portion is provided closer to the flow rate detection element from the solder fixation portion.