- 专利标题： Modular connection device
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申请号： US17464680申请日： 2021-09-02
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公开(公告)号： US12129644B2公开(公告)日： 2024-10-29
- 发明人: Hsiang Wei Lai
- 申请人： Hsiang Wei Lai
- 申请人地址： TW Changhua County
- 专利权人： Hsiang Wei Lai
- 当前专利权人： Hsiang Wei Lai
- 当前专利权人地址： TW Changhua County
- 代理机构： Bruce Stone LLP
- 代理商 Joseph A. Bruce
- 优先权： TW 9130498 2020.09.04
- 主分类号： E04B1/19
- IPC分类号： E04B1/19
摘要：
A modular connection device is provided. The modular connection device includes a base and a plurality of connection members. The base includes a plurality of connection surfaces, wherein each of the connection surfaces is connected with each other. Each of the connection members is detachably connected on each of the connection surfaces.
公开/授权文献
- US20220074191A1 MODULAR CONNECTION DEVICE 公开/授权日：2022-03-10
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