公开(公告)号：US12129644B2

公开(公告)日：2024-10-29

申请号：US17464680

申请日：2021-09-02

申请人： Hsiang Wei Lai

发明人： Hsiang Wei Lai

IPC分类号： E04B1/19

CPC分类号： E04B1/1903 ,  E04B2001/1933 ,  E04B2001/196

摘要： A modular connection device is provided. The modular connection device includes a base and a plurality of connection members. The base includes a plurality of connection surfaces, wherein each of the connection surfaces is connected with each other. Each of the connection members is detachably connected on each of the connection surfaces.

公开(公告)号：US20220074191A1

公开(公告)日：2022-03-10

申请号：US17464680

申请日：2021-09-02

申请人： HSIANG WEI LAI

发明人： HSIANG WEI LAI

IPC分类号： E04B1/19

摘要： A modular connection device is provided. The modular connection device includes a base and a plurality of connection members. The base includes a plurality of connection surfaces, wherein each of the connection surfaces is connected with each other. Each of the connection members is detachably connected on each of the connection surfaces.