An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.