公开(公告)号：US12131862B2

公开(公告)日：2024-10-29

申请号：US17320402

申请日：2021-05-14

Applicant: TDK CORPORATION

Inventor： Kyosuke Inui ,  Makoto Morita ,  Takashi Kudo ,  Toshiyuki Anbo ,  Kyohei Tonoyama ,  Fuyuki Miura ,  Masanori Sugai ,  Eietsu Abe ,  Toru Tonogai ,  Yuichi Oyanagi

IPC: H01F27/29 ,  H01F27/28 ,  H01F41/06

CPC classification number: H01F27/29 ,  H01F27/2823 ,  H01F41/06

Abstract: An electronic component according to the present invention includes: a leadout electrode portion provided on an outer surface of an element main body; and a resin electrode layer formed at a part of the outer surface of the element main body and connected to the leadout electrode portion. The leadout electrode portion contains copper as a main component, and the resin electrode layer includes a conductor powder containing silver, and a resin. Further, a diffusion layer containing copper oxide and silver is formed at an interface between the leadout electrode portion and the resin electrode layer.

公开(公告)号：US10984943B2

公开(公告)日：2021-04-20

申请号：US16014101

申请日：2018-06-21

Applicant: TDK CORPORATION

Inventor： Takashi Kudo

IPC: H01F27/29 ,  H01F5/00 ,  H01F27/28 ,  H01F17/00 ,  H01F17/04

Abstract: An electronic device includes a component body and a terminal electrode formed on a mounting surface of the component body. The chamfered part is formed at an intersection between the mounting surface and a side surface of the component body. An edge of the terminal electrode becomes thinner toward the chamfered part.

公开(公告)号：US12243675B2

公开(公告)日：2025-03-04

申请号：US17490893

申请日：2021-09-30

Applicant: TDK CORPORATION

Inventor： Yusuke Nagai ,  Takashi Suzuki ,  Kazuhiro Ebina ,  Kunihiko Kawasaki ,  Shinichi Kondo ,  Keito Yasuda ,  Ryuichi Wada ,  Makoto Morita ,  Takashi Kudo ,  Kyohei Tonoyama

IPC: H01F5/00 ,  H01F17/00 ,  H01F17/04 ,  H01F27/29

Abstract: In a multilayer coil component, a part filled with a resin and a void part not filled with the resin exist between a plurality of metal magnetic particles in an element body, one main surface of the element body is a mounting surface with respect to an external electronic component, and the edge of an external electrode is positioned on the mounting surface. In the element body, a high void region where the porosity caused by the void part is higher than the porosity of the other part in the element body extends from the edge of the external electrode on the mounting surface toward an end surface of the element body.

公开(公告)号：US11315712B2

公开(公告)日：2022-04-26

申请号：US16033521

申请日：2018-07-12

Applicant: TDK CORPORATION

Inventor： Takashi Kudo ,  Makoto Morita ,  Fuyuki Miura

IPC: H01F27/28 ,  H01F5/04 ,  H01F27/30 ,  H01F27/29 ,  H01F27/255 ,  H01F41/02

Abstract: A coil device includes a coil portion, an element body, and a terminal electrode. The coil portion is formed by a wire wound in a coil shape. The element body contains the coil portion where a part of an outer circumference of a lead-out part of the coil portion is exposed as an exposed portion from a bottom surface of the element body and where the rest of the outer circumference of the lead-out part of the coil portion is embedded as an embedded portion in the element body. The terminal electrode is formed on the bottom surface of the element body and connected with the exposed portion. An embedded length of the outer circumference of the lead-out part in the embedded portion is larger than a substantially half of a full length of the outer circumference of the lead-out part.