Invention Grant
- Patent Title: Chuck for plasma processing chamber
-
Application No.: US17435340Application Date: 2020-03-04
-
Publication No.: US12131890B2Publication Date: 2024-10-29
- Inventor: Ann Erickson , Darrell Ehrlich
- Applicant: Lam Research Corporation
- Applicant Address: US CA Fremont
- Assignee: Lam Research Corporation
- Current Assignee: Lam Research Corporation
- Current Assignee Address: US CA Fremont
- Agency: Beyer Law Group LLP
- International Application: PCT/US2020/021003 2020.03.04
- International Announcement: WO2020/185467A 2020.09.17
- Date entered country: 2021-08-31
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/683
Abstract:
An electrostatic chuck system for a plasma processing chamber is provided. A base plate comprising Al—SiC is provided. A ceramic plate is disposed over the base plate. A bonding layer bonds the ceramic plate to the base plate.
Public/Granted literature
- US20220139681A1 CHUCK FOR PLASMA PROCESSING CHAMBER Public/Granted day:2022-05-05
Information query
