Invention Grant
- Patent Title: Thin film capacitor and electronic circuit substrate having the same
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Application No.: US18012809Application Date: 2020-12-24
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Publication No.: US12132078B2Publication Date: 2024-10-29
- Inventor: Yoshihiko Yano , Daiki Ishii , Kenichi Yoshida , Yuki Yamashita
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rimon P.C.
- International Application: PCT/JP2020/048395 2020.12.24
- International Announcement: WO2022/004019A 2022.01.06
- Date entered country: 2022-12-23
- Main IPC: H01G4/008
- IPC: H01G4/008 ; H01G2/06 ; H01G4/005 ; H01G4/01 ; H01G4/012 ; H01G4/06 ; H01G4/10 ; H01G4/12 ; H01G4/228 ; H01G4/252 ; H01G4/33 ; H01L23/00 ; H01L25/16 ; H01L49/02 ; H05K1/18

Abstract:
To provide a thin film capacitor having high adhesion performance with respect to a multilayer substrate. A thin film capacitor includes: a metal foil having a roughened upper surface; a dielectric film covering the upper surface of the metal foil and having an opening through which the metal foil is partly exposed; a first electrode layer contacting the metal foil through the opening; and a second electrode layer contacting the dielectric film without contacting the metal foil. A height of the first electrode layer is lower than a height of the second electrode layer. This enhances adhesion performance when the thin film capacitor is embedded in a multilayer substrate and improves ESR characteristics.
Public/Granted literature
- US20230253446A1 THIN FILM CAPACITOR AND ELECTRONIC CIRCUIT SUBSTRATE HAVING THE SAME Public/Granted day:2023-08-10
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