Front and back electrode trench capacitor

    公开(公告)号:US11605503B2

    公开(公告)日:2023-03-14

    申请号:US16781459

    申请日:2020-02-04

    IPC分类号: H01G4/10 H01G4/008

    摘要: A capacitor that includes an insulating base material having a first main surface and a second main surface facing each other, the insulating base material defining first and second trenches extending from the first main surface into the base material such that first trench and the second trench overlap each other; a first conductor in the first trench; a first external electrode on the first main surface of the base material and connected to the first conductor; a second conductor in the second trench; and a second external electrode on the second main surface of the base material and connected to the second conductor.

    Method of producing a multi-layer ceramic electronic component

    公开(公告)号:US11551873B2

    公开(公告)日:2023-01-10

    申请号:US16414365

    申请日:2019-05-16

    摘要: A method of producing a multi-layer ceramic electronic component includes: producing a multi-layer unit including ceramic layers that are laminated in a first direction, internal electrodes that are disposed between the ceramic layers, and a side surface that faces in a second direction orthogonal to the first direction, the internal electrodes being exposed on the side surface; sintering the multi-layer unit; and forming a side margin on the side surface of the sintered multi-layer unit.

    VERTICALLY-STACKED INTERDIGITATED METAL-INSULATOR-METAL CAPACITOR FOR SUB-20 NM PITCH

    公开(公告)号:US20220384564A1

    公开(公告)日:2022-12-01

    申请号:US17303390

    申请日:2021-05-27

    IPC分类号: H01L49/02 H01G4/005 H01G4/10

    摘要: An interdigitated metal-insulator-metal capacitor structure is formed by a first unitary body of a first conductive material that includes a first metal plate, a first set of interdigitated electrodes protruding upwards from a top surface of the first metal plate, and a first set of connecting vias protruding downwards from a bottom surface of the first metal plate. A second unitary body of a second conductive material is disposed above the first unitary body and electrically separated from the first unitary body by an insulating layer. The second unitary body includes a second metal plate, a second set of interdigitated electrodes protruding downwards from a bottom surface of the second metal plate, and a second set of connecting vias protruding upwards from a top surface of the second metal plate. The first set of interdigitated electrodes are interleaved with the second set of interdigitated electrodes.

    CAPACITOR DIELECTRIC FOR SHORTER CAPACITOR HEIGHT AND QUANTUM MEMORY DRAM

    公开(公告)号:US20220262801A1

    公开(公告)日:2022-08-18

    申请号:US17592397

    申请日:2022-02-03

    摘要: Embodiments of the present disclosure generally relate to methods of forming a capacitor for DRAM. The method begins by preparing a substrate for forming the capacitor. A bottom electrode is formed on the top surface of the substrate. A dielectric layer is formed in contact with the bottom electrode. The material of the dielectric layer is one of a barium titanate, BaTiO3 (BTO) strontium titanate, SrTiO3 (STO), barium strontium titanate, BaSrTiO3 (BSTO), ZrSTO, ZrBTO, or ZrBSTO. A top electrode is formed on the dielectric layer and then a cap is formed on the top electrode.

    THIN FILM CAPACITOR AND MANUFACTURING METHOD THEREFO

    公开(公告)号:US20220208477A1

    公开(公告)日:2022-06-30

    申请号:US17559189

    申请日:2021-12-22

    申请人: TDK CORPORATION

    摘要: Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second surfaces opposite to each other, a first capacitive electrode covering the first surface of the capacitive insulating film, and a second capacitive electrode covering the second surface of the capacitive insulating film. The first capacitive electrode is made of less noble metal having a lower spontaneous potential than a metal constituting the second capacitive electrode. A minute defective portion existing in the capacitive insulating film is closed by an insulator derived from a metal constituting the first capacitive electrode.