- 专利标题： Package and method for manufacturing package
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申请号： US17588960申请日： 2022-01-31
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公开(公告)号： US12132377B2公开(公告)日： 2024-10-29
- 发明人: Jun Umetsu , Noriyuki Takahashi
- 申请人： Hitachi Metals, Ltd.
- 申请人地址： JP Tokyo
- 专利权人： Proterial, Ltd.
- 当前专利权人： Proterial, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Studebaker & Brackett PC
- 优先权： JP 21019098 2021.02.09
- 主分类号： H02K5/22
- IPC分类号： H02K5/22
摘要：
A package includes therein a power distribution member including a plurality of conductive wires which is sealed in a packaging bag. An oxygen concentration in the packaging bag is lower than that in the atmosphere.
公开/授权文献
- US20220255397A1 PACKAGE AND METHOD FOR MANUFACTURING PACKAGE 公开/授权日：2022-08-11
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