- Patent Title: Electromagnetic interference shields having attentuation interfaces
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Application No.: US17133113Application Date: 2020-12-23
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Publication No.: US12133322B2Publication Date: 2024-10-29
- Inventor: Jaejin Lee , Isaac Simpson , Dong-Ho Han , Jose Salazar Delgado , Arturo Navarro Alvarez
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Hanley, Flight & Zimmerman, LLC
- Main IPC: H05K1/02
- IPC: H05K1/02

Abstract:
Electromagnetic interference (EMI) shields having attenuation interfaces are disclosed. A disclosed example EMI shield includes side walls defining sides of the EMI shield, and an attenuation interface to be placed into contact with a circuit board. The attenuation interface includes an inner perimeter having an EMI absorber and an outer perimeter having a metal backing to at least partially surround the EMI absorber.
Public/Granted literature
- US20210120665A1 ELECTROMAGNETIC INTERFERENCE SHIELDS HAVING ATTENTUATION INTERFACES Public/Granted day:2021-04-22
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