Invention Grant
- Patent Title: Electronic device including a conductive portion and contact member making contact with substrate
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Application No.: US17870977Application Date: 2022-07-22
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Publication No.: US12133342B2Publication Date: 2024-10-29
- Inventor: Geuna Lee , Jinho Lim , Minsu Jung , Kwonho Son
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cha & Reiter, LLC
- Priority: KR 20210097279 2021.07.23
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H04M1/02 ; H05K5/00 ; H05K5/02 ; H05K1/02 ; H05K1/14

Abstract:
According to an embodiment, an electronic device is provided. the electronic device may comprise: a housing including a conductive portion and a non-conductive portion; a first substrate; at least one electronic component disposed on the first substrate; a second substrate electrically coupled to the first substrate, the second substrate including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; at least one contact member disposed between the first surface of the second substrate and the conductive portion of the housing; and a support member disposed between the first surface of the second substrate and the non-conductive portion of the housing.
Public/Granted literature
- US20230021646A1 ELECTRONIC DEVICE INCLUDING A CONDUCTIVE PORTION AND CONTACT MEMBER MAKING CONTACT WITH SUBSTRATE Public/Granted day:2023-01-26
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