公开(公告)号：US12133342B2

公开(公告)日：2024-10-29

申请号：US17870977

申请日：2022-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Geuna Lee ,  Jinho Lim ,  Minsu Jung ,  Kwonho Son

IPC: H05K1/18 ,  H04M1/02 ,  H05K5/00 ,  H05K5/02 ,  H05K1/02 ,  H05K1/14

CPC classification number: H05K5/0069 ,  H04M1/0277 ,  H05K1/189 ,  H05K5/0217 ,  H05K1/0281 ,  H05K1/147 ,  H05K2201/10151 ,  H05K2201/1031 ,  H05K2201/2009 ,  H05K2201/2036

Abstract: According to an embodiment, an electronic device is provided. the electronic device may comprise: a housing including a conductive portion and a non-conductive portion; a first substrate; at least one electronic component disposed on the first substrate; a second substrate electrically coupled to the first substrate, the second substrate including a first surface facing a first direction and a second surface facing a second direction opposite to the first direction; at least one contact member disposed between the first surface of the second substrate and the conductive portion of the housing; and a support member disposed between the first surface of the second substrate and the non-conductive portion of the housing.