- 专利标题: Semiconductor structure and method of forming the same
-
申请号: US18059073申请日: 2022-11-28
-
公开(公告)号: US12133470B2公开(公告)日: 2024-10-29
- 发明人: Harry-Hak-Lay Chuang , Kuei-Hung Shen , Chern-Yow Hsu , Shih-Chang Liu
- 申请人: Taiwan Semiconductor Manufacturing Company Ltd.
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CPMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING CPMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Haynes and Boone, LLP
- 分案原申请号: US16931632 2020.07.17
- 主分类号: H10N50/10
- IPC分类号: H10N50/10 ; H10B61/00 ; H10N50/01 ; H10N50/80
摘要:
The present disclosure provides a semiconductor structure, including an Nth metal layer over a transistor region, where N is a natural number, and a bottom electrode over the Nth metal layer. The bottom electrode comprises a bottom portion having a first width, disposed in a bottom electrode via (BEVA), the first width being measured at a top surface of the BEVA, and an upper portion having a second width, disposed over the bottom portion. The semiconductor structure also includes a magnetic tunneling junction (MTJ) layer having a third width, disposed over the upper portion, a top electrode over the MTJ layer and an (N+1)th metal layer over the top electrode. The first width is greater than the third width.
公开/授权文献
- US20230088093A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME 公开/授权日:2023-03-23
信息查询