Invention Grant
- Patent Title: Three-dimensional printing conductive elements
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Application No.: US17288550Application Date: 2019-04-29
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Publication No.: US12138860B2Publication Date: 2024-11-12
- Inventor: Sterling Chaffins , Thomas A. Saksa , Kevin P. DeKam , Juan Sebastian Ramirez , Dale Peterson , Jami Ryan Barone
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2019/029655 WO 20190429
- International Announcement: WO2020/222743 WO 20201105
- Main IPC: B29C64/295
- IPC: B29C64/295 ; B22F1/054 ; B22F1/10 ; B29C64/165 ; B29C64/268 ; B33Y70/10 ; B33Y10/00 ; B33Y30/00

Abstract:
Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.
Public/Granted literature
- US20220063189A1 THREE-DIMENSIONAL PRINTING CONDUCTIVE ELEMENTS Public/Granted day:2022-03-03
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