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公开(公告)号：US11304313B2
公开(公告)日：2022-04-12
申请号：US16491186
申请日：2017-12-15
IPC分类号： H05K3/46 , B29C64/188 , B29C64/165 , H05K1/03 , H05K3/12 , B33Y10/00 , B33Y70/00
摘要： According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
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公开(公告)号：US20220063189A1
公开(公告)日：2022-03-03
申请号：US17288550
申请日：2019-04-29
发明人： Sterling Chaffins , Thomas A. Saksa , Kevin P. DeKam , Juan Sebastian Ramirez , Dale Peterson , Jami Ryan Barone
IPC分类号： B29C64/165 , B29C64/295 , B29C64/268
摘要： Methods and systems for making three-dimensional printed articles. In one example, a method of making a three-dimensional article can include printing a conductive element including a composite of a conductive material and a polymeric build material; printing an adjacent portion in contact with the conductive element, where the adjacent portion includes a nonconductive polymeric build material; and heating the conductive element by running an electric current through the conductive element, and thereby heating the adjacent portion to a temperature sufficient to change a physical property of the nonconductive polymeric build material of the adjacent portion.
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公开(公告)号：US20210282276A1
公开(公告)日：2021-09-09
申请号：US16491186
申请日：2017-12-15
IPC分类号： H05K3/46 , B29C64/188 , B29C64/165 , H05K3/12 , H05K1/03
摘要： According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.
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