A semiconductor device assembly is provided. The assembly includes a first semiconductor die and a second semiconductor die disposed over the first semiconductor die. The assembly further includes a plurality of die support structures between the first and second semiconductor dies and a plurality of interconnects between the first and second semiconductor dies. Each of the plurality of die support structures includes a stand-off pillar and a stand-off pad having a first bond material with a first solder joint thickness between them. Each of the plurality of interconnects includes a conductive pillar and a conductive pad having a second bond material with a second solder joint thickness between them. The first solder joint thickness is less than the second solder joint thickness.