Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17523054Application Date: 2021-11-10
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Publication No.: US12154989B2Publication Date: 2024-11-26
- Inventor: Akihiro Hanada , Takuo Kaitoh
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Maier & Maier, PLLC
- Priority: JP2020-199568 20201201
- Main IPC: H01L29/786
- IPC: H01L29/786

Abstract:
A semiconductor device includes a thin-film transistor. The thin-film transistor comprises an oxide semiconductor layer, a gate insulating layer, a gate electrode overlapped on the oxide semiconductor layer through the gate insulating layer, a source electrode in contact with the oxide semiconductor layer, a drain electrode in contact with the oxide semiconductor layer and n (n is a natural number) metal layer(s) in contact with the oxide semiconductor layer and disposed across the oxide semiconductor layer between the source electrode and the drain electrode. The oxide semiconductor layer has (n+1) channel regions between the source electrode and the drain electrode in a plan view.
Public/Granted literature
- US20220173248A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-06-02
Information query
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