Invention Grant
- Patent Title: Systems and methods for shaping flexible circuits to improve routing and attachment
-
Application No.: US17889473Application Date: 2022-08-17
-
Publication No.: US12156342B2Publication Date: 2024-11-26
- Inventor: David G. Siegfried , David R. Peterson , Joseph Sudik, Jr.
- Applicant: APTIV TECHNOLOGIES LIMITED
- Applicant Address: BB St. Michael
- Assignee: APTIV TECHNOLOGIES LIMITED
- Current Assignee: APTIV TECHNOLOGIES LIMITED
- Current Assignee Address: BB St. Michael
- Agency: Miller Johnson
- Main IPC: H05K1/02
- IPC: H05K1/02 ; B60R16/02 ; H01L21/268 ; H05K1/18 ; H05K3/00 ; H05K3/14 ; H05K3/16

Abstract:
A system and method for shaping a flexible circuit (FC) having a set of conductive traces disposed within a set of insulation layers and a shaped FC, each involve using a non-conductive tool defining complimentary first and second tool portions and a shape therebetween, the tool being configured to receive a portion of the FC therebetween the first and second tool portions, a set of conductive heating elements arranged substantially in parallel with each other and disposed within the first and second tool portions, and a power source configured to provide power to the conductive heating elements causing the conductive heating elements to generate heat energy to shape the FC portion without removing any of the FC portion.
Public/Granted literature
- US20240064908A1 SYSTEMS AND METHODS FOR SHAPING FLEXIBLE CIRCUITS TO IMPROVE ROUTING AND ATTACHMENT Public/Granted day:2024-02-22
Information query