Invention Grant
- Patent Title: Thickness-limited electrospray deposition
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Application No.: US17251262Application Date: 2019-06-12
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Publication No.: US12162216B2Publication Date: 2024-12-10
- Inventor: Jonathan P. Singer , Lin Lei
- Applicant: Rutgers, the State University of New Jersey
- Applicant Address: US NJ New Brunswick
- Assignee: Rutgers, the State University of New Jersey
- Current Assignee: Rutgers, the State University of New Jersey
- Current Assignee Address: US NJ New Brunswick
- Agency: Wolter Van Dyke Davis, PLLC
- Agent Eugene J. Molinelli; Cian G. O'Brien
- International Application: PCT/US2019/036776 WO 20190612
- International Announcement: WO2019/241394 WO 20191219
- Main IPC: B05D1/04
- IPC: B05D1/04 ; B05D5/00 ; B29C64/188 ; C09D5/24 ; C09D5/26 ; C09D163/00 ; C09D177/06 ; B05B5/025

Abstract:
Self-limiting electrospray compositions including a non-charge-dissipative component and/or a charge-dissipative component. Self-limiting electrospray composition including a plurality of charge-dissipative components and excluding a non-charge-dissipative component. Methods for forming layers of self-limiting thickness. Methods for determining a conductivity of a material. Methods for repairing a flaw in a layer on a surface of an object.
Public/Granted literature
- US20210323006A1 THICKNESS-LIMITED ELECTROSPRAY DEPOSITION Public/Granted day:2021-10-21
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